Uniroyal combines the latest quaternary and ternary compounds, with multiple quantum well (MQW) semiconductor technology, to provide the brightest multicandela class LEDs available. For the best in Visible and UV LED results, choose Uniroyal for “The Light Inside”™ your LED-based product. Uniroyal is your one-stop shop for Epitaxial Wafers, Package Ready Die (PRD)™, and custom LED semiconductors.
POWERGa(i)N™ Technology
UNPRX505-XXX HIGH PERFORMANCE
CYAN LED DIE

Maximum Ratings @ TA = 25° C
DC Forward Current
30mA
Peak Forward Current (<10ms,1/10 Duty cycle)
100mA
Led Junction Temp
100° C
Forward Voltage
4.0 V DC
Reverse Voltage
-5.0 V DC
Operating Temperature Range
-40° C + 85° C
Storage Temperature Range
-40° C+100° C
ESD Class (Mil Std 883)
I

Typical Electrical/Optical Characteristics @ 25° C, 20 mA DC
Part Code Optical
Power
mW
Forward Voltage
Vf, V
Reverse Current
Ir @ 5V, uA
Peak Wavelength
Dominant Wavelength
Spectral
Width
(FWHM)
Series Resistance Rs
 
Typ
Typ
Max
Typ
Max
Typ
Min
Typ
Max
Typ
Typ
0D1
1.0
3.6
4.0
4.0
10.0
495
500
505
515
30
30
0E1
1.2
3.6
4.0
4.0
10.0
495
500
505
515
30
30
0G1
1.6
3.6
4.0
4.0
10.0
495
500
505
515
30
30
0I1
2.0
3.6
4.0
4.0
10.0
495
500
505
515
30
30
0K1
2.4
3.6
4.0
4.0
10.0
495
500
505
515
30
30

Mechanical Specifications
Die Size 325um x 325um ± 15um. (0.013" X 0.013" ±0.0015")
Die Thickness 125um ±20um (0.005±0.0005) Bond Pad 100um diameter
Contact Metal (Both P and N contact are Au for consistent, reliable bonds.) Au
Backside Metal N/A (Unclad)

Options
Sample Tested: Whole diced wafer on tape, die not inked out or removed: UNPRA505-XXX.
100% Tested: With ASCII file and/or die inked out (not removed), sold as whole diced wafer on tape: UNPRB505-XXX.
100% Tested: Die are tested, sorted, binned "Known Binned Die", and sold on tape: UNPRC505-XXX.


Notes:
1. The optical power is determined by probe testing LED with a spectral radiometer. A ± 15% tolerance applies due to measuring variations.
2. The dominant wavelength is determined by probe testing LED with a spectral radiometer. A ± 2nm tolerance applies due to measuring variations.
3. All electro-optical measurements are referenced by measuring bare die mounted on TO-46 headers using an integrating sphere. An index matching encapsulent is not used to enhance these measurements (bare die test only).
4. Maximum ratings are package dependent. Ratings were determined using a T-1 ¾ style package for the electrical drive characterization data cited. Ratings for other package types will differ. The forward current is not limited by the die but by the effect of the package on the device junction temperature.
5. All die products conform to the listed specifications when packaged and operated within the maximum limits shown above. Typical values are provided for information only but are within the range of expected values of acceptable sample sizes.
6. A shipping tolerance of ± 10% applies to all deliveries.

Last unpdated July 10, 2001

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