Uniroyal combines the latest quaternary and ternary compounds, with multiple quantum well (MQW) semiconductor technology, to provide the brightest multicandela class LEDs available. For the best in Visible and UV LED results, choose Uniroyal for “The Light Inside”™ your LED-based product. Uniroyal is your one-stop shop for Epitaxial Wafers, Package Ready Die (PRD)™, and custom LED semiconductors.
POWERBR(ite)™ Technology
UAPRX618-XXX HIGH PERFORMANCE RED LED DIE

Maximum Ratings @ TA = 25° C
DC Forward Current
30mA
Peak Forward Current
(<10ms,1/10 Duty cycle)
100mA
Led Junction Temp
100° C
Forward Voltage
2.5V DC
Reverse Voltage
-5.0 V DC
Operating Temperature Range
-40° C + 85° C
Storage Temperature Range
-40° C+100° C

Typical Electrical/Optical Characteristics @ 25° C, 20 mA DC
Part Code Luminous Intensity
Iv, mcd
Forward Voltage
Vf, V
Reverse Current
Ir @ 5V, uA
Peak Wavelength
Typical Dominant Wavelength
Spectral
Width
(FWHM)
Series Resistance Rs
 
Typ
Typ
Max
Max
Typ
Min
Typ
Max
Typ
Typ
0B2
90-100
2.0
2.4
10.0
625
613
618
623
18
7
0D2
110-120
2.0
2.4
10.0
625
613
618
623
18
7
0E2
120-130
2.0
2.4
10.0
625
613
618
623
18
7
0F2
130-140
2.0
2.4
10.0
625
613
618
623
18
7
0H2
150-160
2.0
2.4
10.0
625
613
618
623
18
7

Mechanical Specifications
Die Size 305um x 305um +/- 15um. (0.012" X 0.012" ±0.0015")
Die Thickness 178um +/-25um (0.007 ±0.001) Bond Pad 110um diameter
Contact Metal (P) Au
Backside Metal (N) Au

Options
LED Die, Sample Tested, whole wafer on tape, rejects not inked out or removed: UAPRA618-XXX.
LED Die, 100% Electrically Tested, with rejects removed, sold as "Known Good Die" on tape: UAPRB618-XXX.

Notes:
1. The luminous intensity is determined by sample testing LED with a beam candela integrating fixture. A ± 15% tolerance applies due to measuring variations
2. The dominant wavelength is determined by testing header mounted bare LED die with a spectral radiometer. A ± 2nm tolerance applies due to measuring variations.
3. Sample electrical testing is performed with die on header. 100% electrically tested product is probe tested prior to wafer dicing.
4. Maximum ratings are package dependent. Ratings were determined using a T-1 ¾ style package for the electrical drive characterization data cited. Ratings for other package types will differ. The forward current is not limited by the die but by the effect of the package on the device junction temperature.
5. All die products conform to the listed specifications when packaged and operated within the maximum limits shown above. Typical values are provided for information only but are within the range of expected values of acceptable sample sizes.
6. A shipping tolerance of ± 10% applies to all deliveries.

Last updated July 10, 2001

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